6800 Image

                          VPS6800

  • Patented Solder Sphere Placement & Feed Method
  • Capable of processing PBGA, CSP, BGA, CBGA and ZIF Connector form factors
  • Low Total Cycle Time
  • Graphical User Interface
  • Comprehensive Diagnostics and Set-Up Options
  • Integral High Resolution Vision System
  • Small Footprint
  • Interchangeable Tooling Capability
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FULLY AUTOMATED SOLDER SPHERE PLACEMENT SYSTEM
In recognition of the need for a diverse configuration Solder Sphere Placement System, OnTarget has designed and engineered the "Versatile Process System 6800". Various system configurations provide out customer the adaptive edge when encountering the various form factors of the BGA industry.

The VPS6800 is a compact, fully-automated system specifically designed for the Flux or Paste Print and Placement of Solder Spheres onto various form factors, such as Strip or Panel substrates. It additionally supports JEDEC Trays, Boats, and Carriers for singulated device applications.

The core process method of OnTarget Systems' equipment is the Patented "Positive Mask Technology", known for it's repeatability, accuracy, and robust production worthiness. This process is inherently greater in performance an capability, as compared to other placement methods, such as Pin Transfer for Pick & Place.

The system is designed with easily adjustable settings and parameters, which enable the user greater control over Fluxing and Solder Sphere Placement, all of which are displayed on an operator friendly Graphical User Interface.

DEVICE LOADING AND HANDLING
BGA Production floor requirements differ and the VPS6800 addresses this need in its availability  in either Left or Right Hand In-Line conveyor Feed or with use of modular high capacity Tray Stackers or Magazine Handlers. Utilizing a back-to-back system configuration and or use of Lane Changing Handlers, production volume increases can be achieved trough multiple product streams entering Reflow and yielding greater UPH processing.

FLUXING
The solder sphere placement system features a dedicated flux screen, paste stencil,  or rigid flux stencil which are compatible with a number of fluxes/Pb or Pb Free paste. The system includes an automated flux/paste dispenser with programmable flux feed and low level sensing, a vision assisted three position micrometer adjustment for screen/stencil to device registration, electronically controlled stroke and speed parameters.

Other key adjustments, such as snap height and squeegee pressure, give the user complete control over the entire fluxing process.

SOLDER SPHERE PLACEMENT
Extremely fast repeatable placement is achieved by OnTarget Systems' patented solder sphere placement method and mechanism that accomplishes simultaneous placement of all spheres on all pads of the substrates. An automated ball-feed reservoir eliminates the interruption of material loading to the system.

Different device configurations are accommodated by modular sub assemblies of interchangeable tool sets.

OPERATOR INTERFACE
A PC running Windows XP® easily guides the user through set-up, initialization, operation, error recovery, and diagnostic routines. From the PC the user may choose one of the three modes of operation: set-up, run, and diagnostic. Within these modes and at a single keystroke, the system may be instructed for print only, place only, print and place, or dry-cycled operation. Set-up adjustment, controlling the specifics of the printing and placement process, also may be preformed directly at this panel. Security lockouts are provided within the software to prevent any unwanted access.

 GENERAL SPECIFICATIONS

PERFORMANCE:
   Yield                99.7% Typical
   Cycle Time        >= 15 sec
   Uptime              98%
   Accuracy           ± 0.05mm @ 3 Sigma
   Vision Accuracy   ± 0.0254mm @ 3 Sigma
   Vision FOV          50.8mm
   MTBF:               168 Hrs.
   MTBA:               4 Hrs.
   MTTR:               < 2 Hrs.        
   Tooling Change    <= 20 min.
   

PRODUCT RANGE:
    Ball Pitch                   0.35mm-1.5mm
    Ball Diameter              0.2mm-1.0mm
    Substrate Thickness    0.25mm-3.0mm
    Singulated Width         5mm-150mm
    Singulated Length       5mm - 300mm
    Strip Width                25mm-150mm
    Strip Length               150mm-300mm
    JEDEC, UHT, MPPO, S.S. Clip Capable
    (consult factory for variances if applicable)
   
FEATURES:
    SECS/GEM Ethernet Capability
    High Resolution Vision Inspection System
    Interchangeable Tooling - APS8600/5100PMT
    OTS/ACRONIS
® Data Recovery System

OPTIONAL FEATURES:
    
SECS/GEM Ethernet Capability    
    Lot Tracking / Barcode Scanning
    Solder Ball Specification Bar Code Scanning
    Sensor Gripper Tooling for Part Absence Detection

FACTORY REQUIREMENTS:
     Electrical    
           200-240VAC 50/60Hz 15A Single Phase
           
      Pneumatic
            80PSI min, 120 PSI max.  5 SCFM