| SEMI-AUTOMATED BGA BALL PLACEMENT SYSTEM |
In
support of
prototype development and low-medium volume production of Ball Grid
Array applications, for PBGA, CBGA, FCBGA, FTBGA, CSP, CABGA, FBGA, and
ZIF connectors, and custom variations of back-end package assembly.
OnTarget Systems has developed the 5020 PMT Ball Placement System.
The 5020 PMT is a compact, semi-automated system specifically designed
for the flux or paste print and placement of solder balls onto various
form factors. It also supports JEDEC tray, and singulated device
formats. Typical cycle time for the 5020 PMT is 30 seconds for total
process.
At the core of OnTarget Systems, is a patented solder ball placement
mechanism which, in contrast to other possible pick and place
techniques, utilizes Positive Mask Technology (PMT) for it's
simplicity, repeatability, and accuracy. This placement mechanism is
identical to that found on OnTarget Systems higher volume systems,
providing a simple migration path as the users' production requirements
grow.
The system is designed with a number of adjustable features to
provide the user with the greatest control over fluxing and placement
parameters. To minimize the set-up time between runs, a range of
interchangeable tooling is available for producing a wide variety of
device types.
| DEVICE LOADING AND HANDLING |
The system can accommodate a
variety of BGA and CSP substrates in
singulated, panel and strip formats. To process multiple singulated
devices simultaneously, an operator directly loads industry standard
boats or JDEC trays into the system. For strips, and for single devices
not suited to boats, arrange of custom tooling, or carrier options are
available.
The solder ball placement
system features
a dedicated screen or stencil print process, which is compatible with a
number of fluxes/Pb or Pb Free paste. The system includes an automated
flux dispenser with programmable flux feed and low level sensing, a
three position micrometer adjustment for screen/stencil to device
registration, pneumatically controlled stroke and speed parameters.
Other key adjustments, such as snap height and squeegee pressure, give
the user complete control over the entire fluxing process.
Extremely fast repeatable
sphere
placement
is achieved by OnTarget Systems' patented solder ball placement
mechanism which accomplishes simultaneous placement of all balls on all
pads of the substrates. An automated ball-feed reservoir eliminates the
interruption of material loading to the system.
Different device configurations are accommodated by a set of
interchangeable tooling.
A graphical color LCD
interface terminal with touchscreen easily guides the user
through set-up,
initialization, operation, error recovery, and diagnostic routines.
From the terminal the user may choose one of the three modes of
operation:
set-up, run, and diagnostic. Within these modes and at a single
keystroke, the system may be instructed for print only, place only,
print and place, or dry-cycled operation. Set-up adjustment,
controlling
the specifics of the printing and placement process, also may be
preformed directly at this terminal. Security lockouts are provided
within
the software to prevent any unwanted access.
|
GENERAL
SPECIFICATIONS
PERFORMANCE:
Yield
99.9% Typical
Cycle Time
30 Seconds/Carrier Typical
Uptime
98%
Accuracy
25 μ @ 3 Sigma
PRODUCT RANGE:
Ball Pitch
0.3mm-1.5mm
Ball Diameter
0.2mm-1.0mm
Substrate Thickness
0.25mm-3.0mm
Singulated Width
5mm-150mm
Singulated Length
5mm - 300mm
Strip Width
25mm-150mm
Strip Length
150mm-300mm
JEDEC Capable
FACTORY REQUIREMENTS:
Electrical
USA:
100VAC, 50/60Hz 10A
International 220/240VAC 50/60Hz 5A
Pneumatic
80PSI
min, 120 PSI max. 3SCFM |
|
(220K)