| FULLY AUTOMATED BALL PLACEMENT SYSTEM |
In
support of
high volume production of Ball Grid
Array applications, for PBGA, CBGA, FCBGA, FTBGA, CSP, CABGA, FBGA, and
ZIF connectors, and custom variations of back-end package assembly.
OnTarget Systems has developed the APS8600 Advanced Placement System.
The APS8600 is a compact, fully automated system specifically designed
for the flux or paste print and placement of solder spheres onto
various
form factors. It also supports JEDEC tray, and singulated device
formats. Typical cycle time for the APS8600 is 10 seconds for total
process.
At the core of OnTarget Systems' APS8600, is a patented solder ball
placement
mechanism which, in contrast to other possible pick and place
techniques, utilizes Positive Mask Technology (PMT) for it's
simplicity, repeatability, and accuracy.
The system is designed with a number of adjustable features to
provide the user with the greatest control over fluxing and placement
parameters. To minimize the set-up time between runs, a range of
interchangeable tooling is available for producing a wide variety of
device types.
| DEVICE LOADING AND HANDLING |
The system is available in two basic
configurations which provide for either JEDEC tray processing or
strip/panel/singulated device in carrier, variations.
In the JEDEC configuration, trays are directly loaded into the high
capacity tray loader/stacker.
Strip substrates or other formats utilize a modular sub-assembly
loader, which readily accepts industry standard magazines and carriers.
The systems is also capable of direct in-line feed of substrates from
customer's up stream conveyor transfer if applicable.
The solder ball placement
system features
a dedicated flux screen, paste stencil, or rigid flux stencil
which
are compatible with a
number of fluxes/Pb or Pb Free paste. The system includes an automated
flux/paste dispenser with programmable flux feed and low level sensing,
a
vision assisted three position micrometer adjustment for screen/stencil
to device
registration, electronically controlled
stroke and speed parameters.
Other key adjustments, such as snap height and squeegee pressure, give
the user complete control over the entire fluxing process.
Extremely fast repeatable ball
placement
is achieved by OnTarget Systems' patented solder ball placement
mechanism which accomplishes simultaneous placement of all balls on all
pads of the substrates. An automated ball-feed reservoir eliminates the
interruption of material loading to the system.
Different device configurations are accommodated by a modular
sub assemblies of interchangeable tool sets.
A PC running Windows XP®
easily guides the user through set-up,
initialization, operation, error recovery, and diagnostic routines.
From the PC the user may choose one of the three modes of operation:
set-up, run, and diagnostic. Within these modes and at a single
keystroke, the system may be instructed for print only, place only,
print and place, or dry-cycled operation. Set-up adjustment,
controlling
the specifics of the printing and placement process, also may be
preformed directly at this panel. Security lockouts are provided within
the software to prevent any unwanted access. |
GENERAL
SPECIFICATIONS
PERFORMANCE:
Yield
99.8% Typical
Cycle Time
~10 sec
Uptime
98%
Accuracy
± 0.05mm @ 3 Sigma
Vision Accuracy ± 0.0254mm @
3 Sigma
Vision FOV
50.8mm
MTBF:
168 Hrs.
MTBA:
4 Hrs.
MTTR:
< 2 Hrs.
Tooling Change <= 20
min.
PRODUCT RANGE:
Ball Pitch
0.35mm-1.5mm
Ball Diameter
0.2mm-1.0mm
Substrate Thickness
0.25mm-3.0mm
Singulated Width
5mm-150mm
Singulated Length
5mm - 300mm
Strip Width
25mm-150mm
Strip Length
150mm-300mm
JEDEC, UHT, MPPO, S.S. Clip Capable
(consult factory for variances if applicable)
FEATURES:
100 JEDEC Tray Capacity
3 Reject Tray Capacity
High Resolution Vision Inspection System
Interchangeable Tooling - APS8600/5100PMT
OTS/ACRONIS®
Data Recovery System
OPTIONAL FEATURES:
SECS/GEM Ethernet
Capability
JEDEC Tray Lot Tracking
/
Barcode Scanning
Solder
Ball
Specification Bar Code Scanning
Sensor Gripper Tooling for Part Absence Detection
Auto / Hands Free Solder Ball Hopper Loader
FACTORY REQUIREMENTS:
Electrical
200-240VAC 50/60Hz 15A Single Phase
Pneumatic
80PSI
min, 120 PSI max. 10 SCFM
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